مناقصه PCB assembly facility

شرح آگهی:

PCB assembly facility
A. Pick and Place machine with Solder paste dispensing machine
1. Minimum PCB size supported
2. Maximum PCB size supported
3. Minimum PCB thickness supported
4. Maximum PCB thickness supported
5. Maximum assembled PCB weight supported
6. Maximum component placement speed
7. Component pitch
8. Component placement size support size range from 0201 inches (0603 metric) to 30 mm x 30 mm
9. Component placement accuracy XY
10. Minimum component height supported
11. Maximum component height supported
12. Automatic feeder capacity (8 mm)
13. Fiducial recognition vision system accuracy
14. Component orientation recognition vision system accuracy
15. Placement position accuracy
16. Max noise level during operation
17. Safety features
18. Signal tower
19. Power input
20. Maintenance kit
21. Solder-paste dispensing system
21A. Maximum dispensing speed
22B. Dispensing accuracy
22C. Minimum dispensed dot size
B. Reflow oven
23. Minimum PCB size supported
24. Maximum PCB size supported
25. Maximum PCB height along with placed components supported
26. Maximum assembled PCB weight supported
27.Heating zones
28. At least 2 at bottom
29. Top and bottom to be independently programmable
30. Maximum temperature
31. Heating technology
32. Temperature profile memory capacity
33. Display LCD/TFT
34. GUI language
35. Smoke filtration system
36. Safety features
37. Power input
c. Accessories for Pick and Place machine
1. 8mm automatic tape feeder
2....

شرایط آگهی:

Closing Date:30/12/2022

برگزار کننده: INDIAN INSTITUTE OF TECHNOLOGY DELHI

منطقه: کشور هند

تاريخ انتشار: 1401/09/14

مهلت دريافت: اعلام نشده

مهلت ارسال: 1401/10/09

تاريخ بازگشايی: اعلام نشده

نوبت اعلام: اعلام نشده

شماره آگهی: IITD/CBME(SP-4033)/2022

منبع: INDIAN INSTITUTE OF TECHNOLOGY DELHI

تلفن: اعلام نشده

فکس: اعلام نشده

ایمیل: اعلام نشده

وب سایت: اعلام نشده